High Performance Thermally Conductive gap filler pads from SinoGuide Technology. Ultra High Thermally Conductive Pads with Exceptional Dielectric Strength.
Thermal Conductivity: 0.2 W/m.k;
Thermal Conductivity: 1.0 ~ 7.5 W/m.k;
Premium Thermal Conductivity: 30~50W/m.k;
REACH, RoHS, UL Compliant;
SinoGuide Thermal Product Catalogue
Thermally-Enhanced conductive insulator is a thermally conductive electrically insulating materials, are designed for a wide variety of applications which be required high performance of heat transfer and electrical isolation. Thermally conductive interface materials (Insulators) are applied to fill the air gaps between the heating elements.
All of our thermal conductive adhesive tape is used for bonding heat disspation fins to microprocessor or power consumption semiconductors, utlimate bonding strength with lower thermal resistance without mechanical fixing for assembly...
Bonding heat sinks onto power components, like microprocessor and semiconductors to eliminate fasteners.
Improves heat transfer between a CPU/chipset and heatsink with easy-to-use phase change materials; Phase-change interface materials are characterized by the material's change from solid to soft aggregate state at a pre-defined temperature - the so-called phase-change temperature.
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