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Full Range Of Thermal Conductive Adhesive Tape

 

Products Features:


All of our Thermal Conductive Adhesive Tape is used for bonding heat disspation fins to microprocessor or power consumption semiconductors, utlimate bonding strength with lower thermal resistance without mechanical fixing for assembly
Double-sided, pressure sensitive adhesive tape
Electrically insulating
Silicone-Free Thermal Pad

Typical Applications Include:

 

--Mount heat sink/spreader onto drive process(BGA)/power converter or Motor control PCB
-- In all applications where a metal/plastic housing is used as heatsink without screw or clip mounting and hot-melt glue
 

Typical Properties of This Materials:

 

Typical Properties of Thermal Conductive Adhesive Tape
Properties Units TCT120 Series TCT120FG Series Test Method
Color --- White White ---
Reinforcement Carrier --- No Fiberglass ---
Thickness Range mm 0.15 0.25 0.15 0.2 0.25 0.25 ---
natural tacky (1- or 2-sided) --- 2 2 2 2 22 ---
Continuous Use Temp -20 to 100 -20 to 100 -20 to 100 -20 to 100 -20 to 100-20 to 100 EN344
ELECTRICAL  
Breakdown Voltage Kv/mm ≥2 ≥4 ≥2 ≥2.5 ≥3.5 ≥4 ASTM D149
Peel Adhesion N/25mm 9.5 11 10.3 11.8 14.515.8 PSTC-7
Holding Adhesion N/25mm/25℃ 10.2 11.8 12.2 14.5 16.818 PSTC-7
THERMAL  
Thermal Conductivity W/m.k 1.0 1.2 1.2 1.2 1.2 1.2 ASTM D5470

 

 

Note:

Standard sheet: 1050mm x 25.50M , Custom configuration Available

 

 

 

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