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Full Range Of Thermal Conductive Putty/Gel

 

Products Features:


3.0 W/mk Thermal Conductivity,Good Thixotropism
Soft and ultra high compressibility for low stress applications
Higher viscosity compound than grease, it eliminates the bleed, separation,pump-out & dirtly other parts usually associated with grease.
Silicone-Free Thermal Pad

Typical Applications Include:

 

--Between heat-generation Conponment and and heatsink.
--Automotive engine control, Graphices Cards, Telecom device.
--Wireless Hub,Military equipment, power supply.
--Entire large panel PCB Cooling
--Any high compression low stess application
 

Typical Properties of This Materials:

 

Typical Properties of Thermal Conductive Putty/Gel
Properties Units TCP300P TCP300G Test Method
Construction & Composition --- White or Light Blue White or Light Blue ---
Color --- Black Black Visual
Min. BondlineThickness mm NA 0.1 ---
Thickness mm 1.0 to 5.0 NA ---
Density (g/cm) 2.88 2.88 ASTM D792
Hardness Shore 00 5 NA ASTM D2240
Viscosity @0.5rpm ≤100 ≤100 ASTM D149
Temperature Range -40 to 200 -40 to 200 EN344
Volume Impedance (ohm-cm) 5 x1014 1 x1013 ASTM D150
Flame Rating   V 0 V 0 UL 94
Thermal Conductivity W/m.k 3.0 3.0 ASTM D5470
 

 

Automated dispensing is by far the most suitable approach for high-speed in-line manufacturing. It permits greater repeatability as well as higher throughput.

 

Integrating Automated Dispensing


Formable cure-in-place gap fillers offer solutions to the challenges facing designers of miniaturised or high-volume assemblies or where the mechanical pressure exerted on components by conventional gap pads must be alleviated.

 

Below info will be helpful for your right application

 

How to transfer or dissipate the heat from the heat-generating components to heat sinks?

How To Select the Right Thermal Interface Materials for your new application?

Pls feel free to contact us as Thermal Management Solutions available in SinoGuide.

 

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