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Custom Thermal Conductive Materials


Products Features:

Thermal conductivity:1.10 W/mk
Fiberglass Reinforcement
Naturally tacky on one side for easy assembly
Electrically insulating
Resist to puncture,shear and tear

Typical Applications Include:


Network Equipement, Mass Storage devices
Highly Stable at extreme Temperature
Required for outstanding heating Transfer 
Cooling Module, Thermal module for Special application 



Products Features:

6.00 W/mk high thermal conductivity
Premium Thermal Pad, Low Thermal Resistance
Ultra conformability for irregular gapping applications
Silicone-Free Thermal Pad

Typical Applications Include:


--Between heat-generation Conponment and and heatsink.
--High-end Set Top Box, Graphices Cards, Telecom device.
--Wireless communication hardware
--Cooling Module, Thermal module.
--Server S-RAMs, BGA packages





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Contact Us

Tel.:+86-755-89375091 Fax.:+86-755-89375092 E-mail: sales@sg-thermal.com
Address: 301, Building A, North Plant, No. 103,Pingxin North Road, Mugu Community,Pinghu Street, Longgang District, Shenzhen,China